Electrolytic plating - List of Manufacturers, Suppliers, Companies and Products

Electrolytic plating Product List

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Introduction to 3D Photolithography Processing Technology

Introduction to 3D Photolithography Processing Technology

Processing technology using "electroplating"!

"3D Photo Riso" is a processing technology that can uniformly form a resist film on any conductive surface. It was developed using "electroplating," which involves immersing the entire substrate in a liquid phase to deposit a metal film. This technology enables photolithography processing to be applied to the entire three-dimensional shape, including edges and corners. 【Features】 ■ Uniform formation of resist film on conductive surfaces ■ Utilizes "electroplating" ■ Photolithography processing possible on the entire three-dimensional shape, including edges and corners *For more details, please refer to the catalog or feel free to contact us.

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Electroplating

Electroplating

Electroplating

Introducing Photo Precision Co., Ltd., which contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as a core technology. This is an introduction to "Electroplating." Processing that involves placing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. ■□■Features■□■ ■ Introduction of a plating system compatible with 6-inch wafers ■ While film formation by vapor deposition is usually less than 1μm, plating can form films of several μm ■ Suitable for processing three-dimensional shapes ■ As a metal film, it can be used for circuit formation requiring specific film thickness or as a sacrificial film for lift-off, and it is also possible to form fine bumps by raising part of the pattern ■ For other functions and details, please download the catalog or contact us.

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Introduction to Electrolytic Plating Processing Technology

Introduction to Electrolytic Plating Processing Technology

Introduction of a plating system compatible with 6-inch wafers! Processing technology capable of forming films of a few micrometers.

"Electroplating" is a processing technology that involves immersing a substrate in an aqueous solution containing ionized metal and passing electricity through the solution to deposit metal onto the surface of the substrate. Film formation through vapor deposition is typically less than 1μm, while plating can form films of several micrometers. Additionally, there is a technology called "semi-additive method" that utilizes this technique to create fine plating patterns. [Features] ■ Deposits metal on the surface of the substrate by passing electricity through the solution ■ Can be used in precision machining fields to achieve desired metal film thickness ■ Capable of forming films of several micrometers ■ Applicable to create fine plating patterns using the "semi-additive method" ■ Introduced a plating system compatible with 6-inch wafers *For more details, please refer to the catalog or feel free to contact us.

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